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High-Precision Molding, Micro Machining & Module Integration for Semiconductor Industry
The semiconductor industry demands extreme precision, material stability, cleanliness, and repeatable quality across every component used in equipment, packaging, and testing systems. From micro-structured plastic parts to ultra-precision machined components and integrated modules, manufacturing capability directly affects yield and reliability.
Ming Li Precision provides integrated manufacturing solutions for semiconductor customers, covering precision mold development, high-performance plastic injection molding, ultra-precision machining, CT 3D inspection, and module-level assembly. Our technologies support semiconductor equipment builders, packaging houses, and advanced component suppliers with reliable and scalable production capabilities.
Precision Mold & Tooling for Semiconductor Components
Semiconductor-related plastic and hybrid components often require micro features, tight tolerances, and stable repeatability. Our mold and tooling capabilities are designed to support complex geometries and high-precision insert structures.
- Precision mold design and manufacturing
- Micro-structure mold fabrication
- Insert mold and multi-component mold systems
- 2K / bi-injection mold design
- High-accuracy mold core and cavity machining
- Mold flow analysis and optimization
- Mold trial and validation services
These capabilities are widely applicable to semiconductor device components, carrier structures, precision holders, and equipment plastic parts.
High-Performance Plastic Injection for Semiconductor Use
Semiconductor applications frequently use advanced engineering plastics for chemical resistance, dimensional stability, and electrical properties. We support a wide range of high-performance molding processes.
- PEEK injection molding
- Micro injection molding
- Insert molding
- 2-shot / multi-shot molding
- LSR and silicone molding
- Precision gear and micro transmission components
- Optical and micro-feature plastic components
Typical applications include semiconductor equipment plastic parts, precision carriers, micro positioning elements, and chemically resistant structural components.
Ultra-Precision Machining for Semiconductor Equipment Parts
Many semiconductor systems require metal and composite parts with micron-level tolerances and fine surface finishes. Our ultra-precision machining services support these requirements across multiple processes.
- Ultra-precision CNC milling (±1 μm class)
- Wire cutting (±1 μm class)
- EDM machining (±1 μm class)
- Laser micro machining and laser texturing
- Precision turning and grinding
- Micro slot and micro hole structures
These processes are suitable for semiconductor equipment components, precision fixtures, alignment parts, micro-mechanical structures, and specialized tooling.
CT 3D Scanning & Non-Destructive Inspection
For semiconductor-grade components, internal quality and dimensional verification are critical. Our industrial CT 3D scanning services provide non-destructive inspection for complex and micro-scale parts.
- X-ray CT internal structure inspection
- Insert molding integrity verification
- Void and shrinkage detection
- Micro feature dimensional validation
- Assembly internal structure analysis
CT inspection helps reduce risk in high-value semiconductor components and supports advanced quality assurance requirements.
Module Assembly & Engineering Integration
Beyond individual parts, semiconductor customers increasingly require module-level supply and integrated subassemblies. We provide assembly and engineering integration services to support this demand.
- OEM component assembly
- Plastic + metal hybrid assemblies
- Precision sub-module assembly
- Custom automation integration
- Total engineering manufacturing support
This enables customers to simplify their supply chain and reduce integration workload.
Typical Semiconductor Application Areas
- Semiconductor equipment components
- Packaging and testing fixtures
- Precision carriers and holders
- Micro plastic functional parts
- Chemical-resistant structural components
- Precision hybrid assemblies
Work with Ming Li Precision
With combined strengths in precision mold making, advanced injection molding, ultra-precision machining, CT inspection, and module assembly, Ming Li Precision supports semiconductor customers with stable quality, tight tolerances, and scalable production capability.
If you are developing semiconductor equipment components or precision functional parts, our engineering team can help evaluate manufacturability and recommend suitable process solutions.
Contact us to discuss your semiconductor component requirements and project specifications.